CMP | Chemical Mechanical Planarization
Chemical Mechanical Planarization (CMP) is an important step that is used repetitively in semiconductor manufacturing. During the CMP process, a polishing tool is used to move an abrasive slurry over the wafer‘s surface, which removes excess material and results in a smooth finish.
CMP slurries typically consist of nano-sized abrasive powders in a chemically reactive solution. Fluid pumps such as Almatec®️ FUTUR Series AODD Pumps can be used to supply the slurry to the CMP polishing tool at a controlled and specific flow rate.
The challenges within the CMP process are the aggressive nature of the chemicals that are used and the abrasiveness of the very fine grinding particles in the polishing medium, which require a pump type that is compatible with these handling characteristics.